CVI provides quick turn bumping of wafers for development, qualification, sampling and prototype builds. Bumps are available in leaded and lead free alloys.
Expedited bump builds can by completed in 4-6 working days.
|
Wafer Materials |
Si, GaAs, Pyrex, Alumina |
Up to 8 |
|---|---|---|
|
RDL |
Cu (typical 6um thick) Al (typical 1.25um thick) |
Aspect and gap (call for details) |
| Passivation layer |
Available PBO, PO and polyimide |
Customer specified |
| Bump |
ENIG pillars, SnPb, SAC and indium solders |
Bump size specified by customer |
|
Thinning |
Down to 100um |
Customer defined |
|
Singulation and pack |
P1 marking available |