The objective of our business is to
provide quick turn, high quality products, reliable service and engineering solutions for our customers.
2009 interview with Terence Collier at APEX/SMTA
- Strategic solutions in the areas of packaging, test,
engineering development, QRA and process control.
- Uunique processes for bumping single die, partial wafer
and full wafers with various solder alloys.
- Provides flip chip assembly and wirebond capability
for product builds.
- NiAu and NiPdAu (electroless) and electrolytic Cu plating
services on Cu and Al.
- Extracting existing die from plastic, ceramic, modules and hermetically sealed assemblies for
reball and wire bond.
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CVInc was founded in 2001 to assist clients improve processes, profit
and time to market. CVInc has introduced and continues to develop proprietary solutions to strengthen our market
offerings.
Papers by Terence Q. Collier
additional papers
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