CVInc
Cleaning Solutions
Home | CVInc. - Who we are | Package Development Services | Advanced Packaging | Single Die and Partial Wafer Bumping | Die/Wafer Bumping - ENIG Plating | Layout, Design and Assembly Capability | Bond Pad Corrosion | Cleaning | Die Extraction and Reball | Partners | Contact Us

Wafer or assembly processing on test hardware, flip chip bumps, bond pads and exposed metal surfaces. Oxides and other contaminants can reduce yield, increase costs and create assembly nightmares! Let CVI help with our solutions:
 
  • Oxide removal and reduced growth
  • Contamination and poor CRES related to your current cleaning solution?
  • Flip chip and copper pillar process improvements
  • Need to improve yield percentage points?
  • Satisfied with the excess and unpredictable needle wear?
  • Could the cause be your cleaning solution?
 
CVI understands the interactions between probe hardware and wafer material that can lead to yield loss as well as lost revenue. We've led  our clients down the right path to resolving their test problems. Let CVI help recover lost front and back-end yield.

CVI can measures the contact friction between the cleaning media and probe (CVI can also measure the friction between probe needle and bond pad). Friction data assures the most optimum solution for probing and cleaning is in place.

Oxides can be a problem at assembly, test and during bump/pillar fabrication. Microetches can erode away base metals completely. Let CVI help provide a solution that attacks the oxides and leave the base metals intact.
 
Technical support on BPS products for assembly improvements is available by contacting us directly.
 

 © Copyright 2003 CVInc.