Probe, Assembly and Wirebond Improvement:
Poor wire bonding and probe (test) is do to corrosion
on the pads. The root cause of the corrosion is a detailed process but CVI has solutions for removing oxide and fluoride corrosion
as well as organic residues that hinder test and wirebond.
CVI has worked with Air Products and Chemicals to utilyze
their decades of front experience to introduce products for improving cycle time, yield and profits by elimination of process
induced problems.
We also have a chemistry that will eliminated the corrosion
induce at saw on bond pads.
Our chemistries will not etch metals like traditional materials. Most will remove oxides in a matter of seconds
yet have etch rates as low as 1A/min on the base metal.