CVInc
Bond Pad Corrosion - Test and Assembly Improvement
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Probe, Assembly and Wirebond Improvement:

Poor wire bonding and probe (test) is do to corrosion on the pads. The root cause of the corrosion is a detailed process but CVI has solutions for removing oxide and fluoride corrosion as well as organic residues that hinder test and wirebond.

CVI has worked with Air Products and Chemicals to utilyze their decades of front experience to introduce products for improving cycle time, yield and profits by elimination of process induced problems.

We also have a chemistry that will eliminated the corrosion induce at saw on bond pads.

Our chemistries will not etch metals like traditional materials. Most will remove oxides in a matter of seconds yet have etch rates as low as 1A/min on the base metal.

 
 

Improved Flip Chip Probing - Removing contamination from pads.

BPS Solutions for Back End Package and Test

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