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Single Die & Partial Wafer Bumping
New product development can
be a long process. And Costly!
Wafer can take up to 12 weeks
to arrive from the fab. For flip chip and wafer level packaging (WLP) add another 4-6 weeks for bumping. Bumping single wafer
also prove extremely costly. Wafers that require redistribution (RDL) can use up to 4 mask levels. At ~$6k per mask for 300mm,
one wafer can cost over $24k just for the mask. Add the bumping cost and one is easily paying ~$30k to bump one wafer.
With no redistribution required
a 200mm bumped wafer can still exceed $10k (about $40/die based on 250 die/wafer) with no reduction in cycle time save two
days. Thus one development project requiring at most 50-200 die can take up to 6 weeks or more and cost $10k to $30k per wafer.
If die requires a respin/design change, double the cost and cycle time. These are production costs and should not be development
cost!
With product life cycles at 6 months this kind
of time is a business killer. And who needs that cost for just a few die. CVI has worked with its customers to cut the cycle
time from weeks to days and saves tens of thousands of dollars along the way. How do we do it? The fastest path to new product
development for flip chip is by bumping single die and partial wafers.
Bumping single die or partial wafers is a quick
and economical solution for development, prototyping, small production builds and product redesigns. Individual bare die,
partial wafers, or complete wafers can be bumped as needed.
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