Example of Resized Pads with NiAu UBM Over Probe Marks

	IC packaging design for DRAM, Wireless, Power, DSP, Wireline, MEMS products •Manufacturing process development BGA, CSP, QFN, PoP, SiP •Technical Consulting Prototype assembly •Volume production recommendations Reliability assessment Flip Chip   Qualification testing WLCSP   Failure analysis Electroless •NiAu plating Custom Design and Assembly Eletrolytic UBM/RDL layers (Cu, Al, etc)