• Die extraction from various plastic and ceramic package types
  • Flip chip die
  • Wirebonded die
  • Modules and stacked die
• Extraction of wirebond and conversion to flip chip
• Die or package extraction from PCB, modules and substrates
• Remove SnPb bumps and replace with SAC (or other alloy swapping)

• Reball
  • BGA, uBGA and CSP
  • Flip Chip
  • Modules

Reball bump size from 25um to over 500um in diameter. Various alloys available.