CVInc
Layout, Design and Assembly Capability
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Development and Protype Builds
 
Expert Packaging and Test Personnel. Our engineers have a minimum of 20 or more years experience. We have engineers which speak various Asian and European languages as well as English.

Example of Substrate Fanout
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  • Gold stud bumping
  • Wire bonding
  • Flip chip die placement and reflow
  • Board assembly
  • Substrate/PCB design and fabrication
  • Dummy wafer builds for probe and WLCSP evaluation.
  • Bumping Services
  • Advance Packaging and Assembly Solutions
 
 
 
Let us help you with your prototype design, fabrication and testing.

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