CVInc
Flip Chip & Solder Bumping
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  • Die Bumping
  • Partial Wafer Bumping
  • Wafer Bumping
  • Electroless Cu, Ni, Pd & Au plating
  • Cu electolytic plating

 
Why CVInc Solder Bumping
CVInc can provided bumped die within 2-3 working days and bumped wafers within 1-2 days in most cases.
  • Development time
  • Reliability
  • Capability
  • Cost
  • Solder joint strength
  • Multiple alloy selection
  • 1 bump per die or 10k bumps per die

UBM - Electroless Cu, Ni, Pd, and Au plating on aluminum, copper, palladium and most metal surface. CVI can add a UBM layer or clean surface for wirebond on most aluminum and copper layers. Fast turn time and various thickness of Ni available.

100um solder balls - 150um pitch

solderbumpsondie.jpg

Call for a quote: CVI can typically turn the die within 2 to 3 working days. Universities, development groups and fabless organizations benefit from ordering single die for evaluation instead of complete wafers.
 
Fast turn time means quicker times to market and cost savings.

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