 |
 |
|
*
100um
solder balls - 150um pitch
(metallization covers the die pattern)
|
|
|
|
|
|
Single die bumping.....
Our process produces eutectic, Pb-free, AuSn, InPb and a number of special
alloys for custom applications. Bump to bump variability is reduced compared to other processes.
Most processes use gold studs followed by thermocompression or thermosonic
bonding. Both techniques can be acceptable for low I/O count devices but the availability of tools for the bonding might prove
difficult.
High I/O count devices can require enough energy to destroy the device
during processing. Thermosonic can be difficult to bond to some board materials whereas thermocompression can generate
excessive heat.
We have also successfully attached solder balls to bare Al bond pads.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Partial wafer and complete wafer bumping..........
Similar to our single die bumping, the CVI process can place bumps of any
geometry and an alloy. Custom applications included placing multiple alloys on the same wafer and even on the same die to
perform within die comparisons.
Other processes can yield variability due to variances in bump geometry.
Solder jetting introduces variability, inconsistency and voiding in
the solder bumps. Both viscosity of the paste and the metal load changes over time. Our process eliminated these variables.
The CVI process can also be useful for repairing individual bumps within
the wafer.
|
|
|
|
|
|
|
|
|
Call for a quote:
We can typically turn the die within 1to 2 working
days. Universities, development groups and fabless organizations can benefit from ordering single die for evaluation instead
of complete wafers.
Fast turn time means quicker times to market
and cost savings.
solder bumping......not jetting
or stud bumping
CVInc. * 850 S. Greenville,
Suite 108 * Richardson, Texas * 75081 * USA
214-557-1568
© Copyright 2003 CVInc.
|
