Copyright 2014 CVInc all rights
About Us
Our Services
CVI Technology
  Process   Description   In-house or Partner  
 Board layout  PCB, RDL and substrate design, layout and


  In house capability for standard and high


  Fabrication   Inorganic and organic substrate fabrication.
  PCB outsourced. All wafers, QFN and
 modules in  house.
  Wafer thinning   Thinning down to 100um   Partner – same day service
  Singulation   Die and package singulation   Partner – same day service
 Pick and place
  Pick and place into waffle packs or vacuum
 gel packs
 In house staffing and resources.

Die and component


Placement equipment has less than 5um accuracy

for bumped die. Can handle die as small as .25um

 In house equipment, engineers and design

 resources.Wirebonders, die placement tools

 and reflow equipment.

Gold stud bump/ENIG


Bump die and attach thermosonically or with ACP


In house

Die Bumping Wafer Bumping  Packaging  Assembly  PCB and Repair Kits  Dummy Die