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Solder bumps as small as 25um have been applied
CVI can also grow pillars on single die using a NiPdAu or NiAu stack. This process is a cost savings over 20um tall pure Au
pillars used in RF, RFID and optical assemblies.
CVI supports three forms of bumping SINGLE DIE and wafers.
1.Standard solder bumping where a UBM and solder bump are formed.
This is the most similar to high volume, high reliability bumps on the market.
2.Modified solder bumps where a gold stud bump is placed
on the pad and the die is then placed in solder to grow a bump.
3.Thermosonic or ultrasonic bumping. A gold stud bump is applied to
the die. The die is then thermosonically attached to the substrate.