Copyright 2014 CVInc all rights
About Us
Our Services
CVI Technology
Our Services
 Die Bumping  Single die and partial wafers

Complete wafer bumping, RDL and ENIG pillars.

(more info)


Overmolded QFN, open cavity solutions, die

extraction and BGA.  (more info)


Assembly services for small form factor

 boards and modules (more info)

 PCB Layout and Repair Kits  

PCB and substrate layout. Die repair kits

 (more info)

 Dummy Die  

Wide variety of dummy die in pad and bump

 format. Custom builds optional (more info)


For additional information, solutions or to check contact CVI at or

call 972-664-1568

Die Bumping Wafer Bumping  Packaging  Assembly  PCB and Repair Kits  Dummy Die