CVInc. - Who we are
Package Development Services
Single Die and Partial Wafer Bumping
Die/Wafer Bumping - ENIG Plating
Layout, Design and Assembly Capability
Bond Pad Corrosion
Die Extraction and Reball
Welcome to CVInc
Thank you for visiting. Please review our current offerings and feel free to contact us to discuss how our solutions could help increase profits and time to market.
Areas of Expertise
Advance Packaging Solutions
Flip Chip and Solder Bumping
Wafer and Packaging Cleaning Solutions
Layout, Design & Assembly
Die Extraction and Reballing
Probe and Test Improvement Solutions
Please feel free to contact CVI to discuss improving your strategic engineering needs.
e-mail CVI at:
Alternate email for CVInc (large files, general info, etc):
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