CVInc
Home
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CVInc. - Who we are
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Package Development Services
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Advanced Packaging
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Single Die and Partial Wafer Bumping
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Die/Wafer Bumping - ENIG Plating
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Layout, Design and Assembly Capability
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Bond Pad Corrosion
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Cleaning
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Die Extraction and Reball
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Partners
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Contact Us
Welcome to CVInc
C
ustomers
V
alue and
I
mprovement
Thank you for visiting. Please review our current offerings and feel free to contact us to discuss how our solutions could help increase profits and time to market.
(click here)
Areas of Expertise
:
Advance Packaging Solutions
Flip Chip and Solder Bumping
Wafer and Packaging Cleaning Solutions
Layout, Design & Assembly
Die Extraction and Reballing
Probe and Test Improvement Solutions
Please feel free to contact CVI to discuss improving your strategic engineering needs.
e-mail CVI at:
TQCollier@covinc.com
Alternate email for CVInc (large files, general info, etc):
TQCollier.284@gmail.com
© Copyright 2003 CVInc.
